Vacuum Chuck with modular design for efficient substrate handling, integrated with the QFN 3.5 x 4 Chuck Table, delivers high precision cutting and accurate separation for advanced semiconductor packaging. Built with high strength materials, it improves yield, reduces downtime, and ensures stable, efficient performance. Contact us for custom solutions.
Parameter | Specification |
|---|---|
Model | QFN 3.5 x 4 - Chuck Table |
Compatible Package Size | 3.5 x 4 mm |
Material | High-strength engineered alloy/plastic |
Application | Semiconductor, electronics manufacturing |
Durability | High-load, long-term use |
The QFN 3.5 x 4 - Chuck Table ensures precise positioning and stable support for miniature BGA components during cutting.
Its fine-tuning mechanism meets strict quality requirements for every process. The modular design minimizes maintenance downtime, making it ideal for efficient semiconductor manufacturing.
Chenjie Precision Machinery Co., Ltd. specializes in precision fixtures and automation equipment for the electronics and semiconductor industries.
We provide complete design-to-production services, with expertise in cutting fixtures for QFN, BGA, Flip Chip, and customized USB 3.0 substrates. Our solutions address warpage, vacuum insufficiency, and alignment issues, helping customers achieve higher yield and reliable performance in advanced packaging applications.
Looking for a reliable substrate cutting solution for your semiconductor line?
Request a Quotation or Contact Our Sales Team to learn how our pallet tables can be tailored to your process
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